Packaging provider Stora Enso and NXP Semiconductors have formed a partnership to develop intelligent packaging solutions designed to track packages through the supply chain and detect tampering. To accelerate adoption, the companies will open a new packaging Innovation Center in Helsinki later this year.
By using NXP’s near field communication (NFC) and UHF RFID technologies, Stora Enso CEO Karl-Henrik Sundström envisions the day when smart packages can be easily tracked and traced through the entire supply chain, providing full end-to-end transparency. Commercial activity at Stora Enso’s MFC pre-commercial production plant at Imatra, Finland started early this year.
The RFID-enabled solution will detect if the intelligent package has been tampered with en route to the consumer. Once in the hands of the consumer, the solution could provide additional information and interaction through NFC-enabled smart phones.
This visibility and insight is critical for brands and major manufacturers to ensure their products are being shipped and handled correctly. For consumers the benefits are two-fold; the intelligent packaging will be able to verify the authenticity of the product and also provide care, usage and other important information via the NFC-enabled tag.
“Our RFID technology in combination with Stora Enso’s packaging solutions creates additional value to both consumers and brand owners by providing information and insights along the complete supply chain,” says Ruediger Stroh, EVP & GM Security & Connectivity and member of the International Board of Management at NXP Semiconductors.
“The ability of the RFID tag to detect when a package has been compromised and also provide additional product information via NFC truly enables a unique, smart, engaging brand experience and is another example of how security can be broadly implemented to protect our everyday lives.”